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| No-Clean Solder Paste | |
| Based upon US/Japan technologies, totally self-developed. Self-improving ability to meet the require- ments of the developing SMT process. High quality printability clear and stable outline. Smooth printing is available even after 4 hours idle time. Good hot slump performance, better thean the requirements in IPC J-STD-005. The passing rate of first time ICT is over than 97% |
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| Note: We still have other solder paste products with different powder size or special flux formulation, please inquire us for the details. |
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| AVAILABLE PACKAGE |
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| ■ Jars－500 gram jars. | |
